Electrical modeling of the chip scale BGA

The CSBGA package-modeling program can rapidly generate a model from a specific description of a package or from partial information when only a rough approximation is needed. This innovative new software is targeted for the engineer who, at his desktop PC or workstation, can rapidly generate an acc...

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Bibliographische Detailangaben
Hauptverfasser: Caggiano, M.F., Brush, R.M., Kleban, J.T., Chuaypradit, P.J.
Format: Tagungsbericht
Sprache:eng
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Beschreibung
Zusammenfassung:The CSBGA package-modeling program can rapidly generate a model from a specific description of a package or from partial information when only a rough approximation is needed. This innovative new software is targeted for the engineer who, at his desktop PC or workstation, can rapidly generate an accurate electrical model of a chip scale BGA. Program operation consists of entering the available data, and retrieving output that can be used in a simulation, or simply analyzed for an idea as to the range of values the parasitic effects take. The whole process will just take minutes. The program was designed to be fast and portable contrasting other methods of modeling in which such attributes were sacrificed for greater accuracy. Such accuracy may not be desired in most applications where there is a greater emphasis on speed or where powerful workstations are not available. The models targeted for both data processing and RF systems will have a wide range of use across military and commercial electronics applications.
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.1998.678906