Characterization and Modeling of the Conducted Emission of Integrated Circuits Up To 3 GHz

In this paper, an electrical model in order to predict the electromagnetic compatibility (EMC) conducted emission of integrated circuits (ICs) up to 3 GHz is presented. The electrical model predicts the behavior of the propagation paths of electromagnetic conducted emissions at high frequency by inc...

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Veröffentlicht in:	IEEE transactions on electromagnetic compatibility 2014-08, Vol.56 (4), p.878-884
Hauptverfasser:	Berbel, Nestor, Fernandez-Garcia, Raul, Gil, Ignacio
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Circuits electrònics Circuits integrats Circuits integrats de microones Clock generators Compatibilitat electromagnètica computational electromagnetics CEM Conducted emissions Cross-disciplinary physics: materials science rheology Electromagnetic compatibility electromagnetic compatibility (EMC) Electronics Emission Enginyeria electrònica Exact sciences and technology feature selective validation (FSV) Frequency ranges IC emission model (ICEM-CE) Impedance Impedance (Electricity) Impedància (Electricitat) Inductive coupling integrated circuit (IC) Integrated circuit modeling Integrated circuits internal activity (IA) Materials science Mathematical models Microwave integrated circuits Miscellaneous Nanoscale materials and structures: fabrication and characterization Other topics in nanoscale materials and structures Physics Predictive models selective validation FSV Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Spectra Superconducting devices Transmission line measurements Vacuum microelectronics Àrees temàtiques de la UPC
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