Characterization and Modeling of the Conducted Emission of Integrated Circuits Up To 3 GHz
In this paper, an electrical model in order to predict the electromagnetic compatibility (EMC) conducted emission of integrated circuits (ICs) up to 3 GHz is presented. The electrical model predicts the behavior of the propagation paths of electromagnetic conducted emissions at high frequency by inc...
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Veröffentlicht in: | IEEE transactions on electromagnetic compatibility 2014-08, Vol.56 (4), p.878-884 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | In this paper, an electrical model in order to predict the electromagnetic compatibility (EMC) conducted emission of integrated circuits (ICs) up to 3 GHz is presented. The electrical model predicts the behavior of the propagation paths of electromagnetic conducted emissions at high frequency by including all distributed effects and capacitive and inductive couplings. The proposed model has been compared with the standard IC emission model (ICEM-CE) to predict the EMC of a clock generator by means of the feature selective validation (FSV) method. The results show that the proposed model can expand the frequency range up to 3 GHz with a high degree of accuracy. Moreover, an alternative approach to model the electromagnetic noise that is based on the analysis of its spectral components is proposed. |
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ISSN: | 0018-9375 1558-187X |
DOI: | 10.1109/TEMC.2013.2294256 |