Characterization and Modeling of the Conducted Emission of Integrated Circuits Up To 3 GHz
In this paper, an electrical model in order to predict the electromagnetic compatibility (EMC) conducted emission of integrated circuits (ICs) up to 3 GHz is presented. The electrical model predicts the behavior of the propagation paths of electromagnetic conducted emissions at high frequency by inc...
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| Veröffentlicht in: | IEEE transactions on electromagnetic compatibility 2014-08, Vol.56 (4), p.878-884 |
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| creator | Berbel, Nestor Fernandez-Garcia, Raul Gil, Ignacio |
| description | In this paper, an electrical model in order to predict the electromagnetic compatibility (EMC) conducted emission of integrated circuits (ICs) up to 3 GHz is presented. The electrical model predicts the behavior of the propagation paths of electromagnetic conducted emissions at high frequency by including all distributed effects and capacitive and inductive couplings. The proposed model has been compared with the standard IC emission model (ICEM-CE) to predict the EMC of a clock generator by means of the feature selective validation (FSV) method. The results show that the proposed model can expand the frequency range up to 3 GHz with a high degree of accuracy. Moreover, an alternative approach to model the electromagnetic noise that is based on the analysis of its spectral components is proposed. |
| doi_str_mv | 10.1109/TEMC.2013.2294256 |
| format | Article |
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The electrical model predicts the behavior of the propagation paths of electromagnetic conducted emissions at high frequency by including all distributed effects and capacitive and inductive couplings. The proposed model has been compared with the standard IC emission model (ICEM-CE) to predict the EMC of a clock generator by means of the feature selective validation (FSV) method. The results show that the proposed model can expand the frequency range up to 3 GHz with a high degree of accuracy. Moreover, an alternative approach to model the electromagnetic noise that is based on the analysis of its spectral components is proposed.</description><identifier>ISSN: 0018-9375</identifier><identifier>EISSN: 1558-187X</identifier><identifier>DOI: 10.1109/TEMC.2013.2294256</identifier><identifier>CODEN: IEMCAE</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Applied sciences ; Circuits electrònics ; Circuits integrats ; Circuits integrats de microones ; Clock generators ; Compatibilitat electromagnètica ; computational electromagnetics CEM ; Conducted emissions ; Cross-disciplinary physics: materials science; rheology ; Electromagnetic compatibility ; electromagnetic compatibility (EMC) ; Electronics ; Emission ; Enginyeria electrònica ; Exact sciences and technology ; feature selective validation (FSV) ; Frequency ranges ; IC emission model (ICEM-CE) ; Impedance ; Impedance (Electricity) ; Impedància (Electricitat) ; Inductive coupling ; integrated circuit (IC) ; Integrated circuit modeling ; Integrated circuits ; internal activity (IA) ; Materials science ; Mathematical models ; Microwave integrated circuits ; Miscellaneous ; Nanoscale materials and structures: fabrication and characterization ; Other topics in nanoscale materials and structures ; Physics ; Predictive models ; selective validation FSV ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Spectra ; Superconducting devices ; Transmission line measurements ; Vacuum microelectronics ; Àrees temàtiques de la UPC</subject><ispartof>IEEE transactions on electromagnetic compatibility, 2014-08, Vol.56 (4), p.878-884</ispartof><rights>2015 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Aug 2014</rights><rights>info:eu-repo/semantics/openAccess</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c398t-5bf4ceb9db311c35cd549ac583b49e810b60fbbdbb9c6c83efd45e84004b798f3</citedby><cites>FETCH-LOGICAL-c398t-5bf4ceb9db311c35cd549ac583b49e810b60fbbdbb9c6c83efd45e84004b798f3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6691947$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>230,314,777,781,793,882,26955,27905,27906,54739</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/6691947$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=28807592$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Berbel, Nestor</creatorcontrib><creatorcontrib>Fernandez-Garcia, Raul</creatorcontrib><creatorcontrib>Gil, Ignacio</creatorcontrib><title>Characterization and Modeling of the Conducted Emission of Integrated Circuits Up To 3 GHz</title><title>IEEE transactions on electromagnetic compatibility</title><addtitle>TEMC</addtitle><description>In this paper, an electrical model in order to predict the electromagnetic compatibility (EMC) conducted emission of integrated circuits (ICs) up to 3 GHz is presented. The electrical model predicts the behavior of the propagation paths of electromagnetic conducted emissions at high frequency by including all distributed effects and capacitive and inductive couplings. The proposed model has been compared with the standard IC emission model (ICEM-CE) to predict the EMC of a clock generator by means of the feature selective validation (FSV) method. The results show that the proposed model can expand the frequency range up to 3 GHz with a high degree of accuracy. Moreover, an alternative approach to model the electromagnetic noise that is based on the analysis of its spectral components is proposed.</description><subject>Applied sciences</subject><subject>Circuits electrònics</subject><subject>Circuits integrats</subject><subject>Circuits integrats de microones</subject><subject>Clock generators</subject><subject>Compatibilitat electromagnètica</subject><subject>computational electromagnetics CEM</subject><subject>Conducted emissions</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Electromagnetic compatibility</subject><subject>electromagnetic compatibility (EMC)</subject><subject>Electronics</subject><subject>Emission</subject><subject>Enginyeria electrònica</subject><subject>Exact sciences and technology</subject><subject>feature selective validation (FSV)</subject><subject>Frequency ranges</subject><subject>IC emission model (ICEM-CE)</subject><subject>Impedance</subject><subject>Impedance (Electricity)</subject><subject>Impedància (Electricitat)</subject><subject>Inductive coupling</subject><subject>integrated circuit (IC)</subject><subject>Integrated circuit modeling</subject><subject>Integrated circuits</subject><subject>internal activity (IA)</subject><subject>Materials science</subject><subject>Mathematical models</subject><subject>Microwave integrated circuits</subject><subject>Miscellaneous</subject><subject>Nanoscale materials and structures: fabrication and characterization</subject><subject>Other topics in nanoscale materials and structures</subject><subject>Physics</subject><subject>Predictive models</subject><subject>selective validation FSV</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Spectra</subject><subject>Superconducting devices</subject><subject>Transmission line measurements</subject><subject>Vacuum microelectronics</subject><subject>Àrees temàtiques de la UPC</subject><issn>0018-9375</issn><issn>1558-187X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2014</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><sourceid>XX2</sourceid><recordid>eNpdkU1r3DAQhkVpodu0P6D0IiiFXrzVpyUdi9kmgYRcNlB6EZI8ThQcayvZh-bXV2aXtAQxiJl53mGGF6GPlGwpJebbfnfdbRmhfMuYEUy2r9CGSqkbqtXP12hDCNWN4Uq-Re9KeaipkIxv0K_u3mUXZsjxyc0xTdhNPb5OPYxxusNpwPM94C5N_VKhHu8eYykrVjuX0wx32a3lLuawxLng2wPeJ8zx-cXTe_RmcGOBD6f_DN3-2O27i-bq5vyy-37VBG703Eg_iADe9J5TGrgMvRTGBam5FwY0Jb4lg_e99ya0QXMYeiFBC0KEV0YP_AzR49xQlmAzBMjBzTa5-C9ZgxHFLONGGVo1X4-aQ06_FyizrXcFGEc3QVqKpbJVlNWnKvr5BfqQljzViyolKdNcKv7fEjmVkmGwhxwfXf5jKbGrQ3Z1yK4O2ZNDVfPlNNmV4MYhuynE8ixkWhMlDavcpyMXAeC53baGGqH4X1qimIk</recordid><startdate>20140801</startdate><enddate>20140801</enddate><creator>Berbel, Nestor</creator><creator>Fernandez-Garcia, Raul</creator><creator>Gil, Ignacio</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>F28</scope><scope>FR3</scope><scope>XX2</scope></search><sort><creationdate>20140801</creationdate><title>Characterization and Modeling of the Conducted Emission of Integrated Circuits Up To 3 GHz</title><author>Berbel, Nestor ; Fernandez-Garcia, Raul ; Gil, Ignacio</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c398t-5bf4ceb9db311c35cd549ac583b49e810b60fbbdbb9c6c83efd45e84004b798f3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2014</creationdate><topic>Applied sciences</topic><topic>Circuits electrònics</topic><topic>Circuits integrats</topic><topic>Circuits integrats de microones</topic><topic>Clock generators</topic><topic>Compatibilitat electromagnètica</topic><topic>computational electromagnetics CEM</topic><topic>Conducted emissions</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Electromagnetic compatibility</topic><topic>electromagnetic compatibility (EMC)</topic><topic>Electronics</topic><topic>Emission</topic><topic>Enginyeria electrònica</topic><topic>Exact sciences and technology</topic><topic>feature selective validation (FSV)</topic><topic>Frequency ranges</topic><topic>IC emission model (ICEM-CE)</topic><topic>Impedance</topic><topic>Impedance (Electricity)</topic><topic>Impedància (Electricitat)</topic><topic>Inductive coupling</topic><topic>integrated circuit (IC)</topic><topic>Integrated circuit modeling</topic><topic>Integrated circuits</topic><topic>internal activity (IA)</topic><topic>Materials science</topic><topic>Mathematical models</topic><topic>Microwave integrated circuits</topic><topic>Miscellaneous</topic><topic>Nanoscale materials and structures: fabrication and characterization</topic><topic>Other topics in nanoscale materials and structures</topic><topic>Physics</topic><topic>Predictive models</topic><topic>selective validation FSV</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Spectra</topic><topic>Superconducting devices</topic><topic>Transmission line measurements</topic><topic>Vacuum microelectronics</topic><topic>Àrees temàtiques de la UPC</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Berbel, Nestor</creatorcontrib><creatorcontrib>Fernandez-Garcia, Raul</creatorcontrib><creatorcontrib>Gil, Ignacio</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE/IET Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Recercat</collection><jtitle>IEEE transactions on electromagnetic compatibility</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Berbel, Nestor</au><au>Fernandez-Garcia, Raul</au><au>Gil, Ignacio</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Characterization and Modeling of the Conducted Emission of Integrated Circuits Up To 3 GHz</atitle><jtitle>IEEE transactions on electromagnetic compatibility</jtitle><stitle>TEMC</stitle><date>2014-08-01</date><risdate>2014</risdate><volume>56</volume><issue>4</issue><spage>878</spage><epage>884</epage><pages>878-884</pages><issn>0018-9375</issn><eissn>1558-187X</eissn><coden>IEMCAE</coden><abstract>In this paper, an electrical model in order to predict the electromagnetic compatibility (EMC) conducted emission of integrated circuits (ICs) up to 3 GHz is presented. The electrical model predicts the behavior of the propagation paths of electromagnetic conducted emissions at high frequency by including all distributed effects and capacitive and inductive couplings. The proposed model has been compared with the standard IC emission model (ICEM-CE) to predict the EMC of a clock generator by means of the feature selective validation (FSV) method. The results show that the proposed model can expand the frequency range up to 3 GHz with a high degree of accuracy. Moreover, an alternative approach to model the electromagnetic noise that is based on the analysis of its spectral components is proposed.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/TEMC.2013.2294256</doi><tpages>7</tpages><oa>free_for_read</oa></addata></record> |
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| ispartof | IEEE transactions on electromagnetic compatibility, 2014-08, Vol.56 (4), p.878-884 |
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| subjects | Applied sciences Circuits electrònics Circuits integrats Circuits integrats de microones Clock generators Compatibilitat electromagnètica computational electromagnetics CEM Conducted emissions Cross-disciplinary physics: materials science rheology Electromagnetic compatibility electromagnetic compatibility (EMC) Electronics Emission Enginyeria electrònica Exact sciences and technology feature selective validation (FSV) Frequency ranges IC emission model (ICEM-CE) Impedance Impedance (Electricity) Impedància (Electricitat) Inductive coupling integrated circuit (IC) Integrated circuit modeling Integrated circuits internal activity (IA) Materials science Mathematical models Microwave integrated circuits Miscellaneous Nanoscale materials and structures: fabrication and characterization Other topics in nanoscale materials and structures Physics Predictive models selective validation FSV Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Spectra Superconducting devices Transmission line measurements Vacuum microelectronics Àrees temàtiques de la UPC |
| title | Characterization and Modeling of the Conducted Emission of Integrated Circuits Up To 3 GHz |
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