Advanced microelectronic packaging using BeO ceramics

Beryllia ceramics have been successfully used during the last forty years to produce reliable packaging solutions for a wide range of commercial microelectronic packaging applications. Ceramic properties have been well defined and consistently controlled throughout production of many millions of cir...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Sepulveda, J.L.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Ceramics Copper Electronic packaging thermal management Electronics packaging Gold Metallization Microelectronics Substrates Thermal conductivity Thermal resistance
Online-Zugang:	Volltext bestellen
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