Advanced microelectronic packaging using BeO ceramics

Advanced microelectronic packaging using BeO ceramics

Beryllia ceramics have been successfully used during the last forty years to produce reliable packaging solutions for a wide range of commercial microelectronic packaging applications. Ceramic properties have been well defined and consistently controlled throughout production of many millions of cir...

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Bibliographische Detailangaben
1. Verfasser: Sepulveda, J.L.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Ceramics
Copper
Electronic packaging thermal management
Electronics packaging
Gold
Metallization
Microelectronics
Substrates
Thermal conductivity
Thermal resistance
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Beschreibung
Zusammenfassung:Beryllia ceramics have been successfully used during the last forty years to produce reliable packaging solutions for a wide range of commercial microelectronic packaging applications. Ceramic properties have been well defined and consistently controlled throughout production of many millions of circuits to insure high performance operation and product reliability.
DOI:10.1109/ISAPM.1998.664472