Bonding methods for modular micro-robotic assemblies

To address some of the challenges in modular micro-robotics, we present a new heat-activated bonding method for assembly. This bonding method quickly forms strong bonds through the use of thermoplastic or solder binding sites integrated into each module face, addressing problems of assembly strength...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Diller, Eric, Naicheng Zhang, Sitti, Metin
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Bonding Coils Force Heating Lasers Robots
Online-Zugang:	Volltext bestellen
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