Ultra-thin chips for flexible electronics

Ultra-thin chips for flexible electronics

Various aspects of ultra-thin chip technology for flexible electronics based on Chipfilm™ technology are presented and discussed, including ultra-thin-chip fabrication, mechanical and electrical characterization, as well as chip assembly and imbedding.

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Bibliographische Detailangaben
Hauptverfasser: Burghartz, J. N., Angelopoulos, E., Appel, W., Endler, S., Ferwana, S., Harendt, C., Hassan, M.-U, Rempp, H., Richter, H., Zimmermann, M.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
chip stacking
mechanical stability
piezoresistive effect
process window
thin chips
thin-chip fabrication
warpage
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Beschreibung
Zusammenfassung:Various aspects of ultra-thin chip technology for flexible electronics based on Chipfilm™ technology are presented and discussed, including ultra-thin-chip fabrication, mechanical and electrical characterization, as well as chip assembly and imbedding.
DOI:10.1109/EDSSC.2013.6628168