Endpoint detection using optical emission spectroscopy in TSV fabrication

A hybrid partial least squares-support vector machine (PLS-SVM) model of optical emission spectroscopy data is proposed and successfully demonstrated to predict the endpoint detection of through silicon vias (TSVs) etched using the Bosch process. Accurate results are shown for TSVs with diameters of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ja Myung Gu, Thadesar, Paragkumar A., Dembla, Ashish, Sang Jeen Hong, Bakir, Muhannad S., May, Gary S.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Etching Optical device fabrication Silicon Smoothing methods Stimulated emission Support vector machines Through-silicon vias
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