Endpoint detection using optical emission spectroscopy in TSV fabrication

Endpoint detection using optical emission spectroscopy in TSV fabrication

A hybrid partial least squares-support vector machine (PLS-SVM) model of optical emission spectroscopy data is proposed and successfully demonstrated to predict the endpoint detection of through silicon vias (TSVs) etched using the Bosch process. Accurate results are shown for TSVs with diameters of...

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Bibliographische Detailangaben
Hauptverfasser: Ja Myung Gu, Thadesar, Paragkumar A., Dembla, Ashish, Sang Jeen Hong, Bakir, Muhannad S., May, Gary S.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Etching
Optical device fabrication
Silicon
Smoothing methods
Stimulated emission
Support vector machines
Through-silicon vias
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Beschreibung
Zusammenfassung:A hybrid partial least squares-support vector machine (PLS-SVM) model of optical emission spectroscopy data is proposed and successfully demonstrated to predict the endpoint detection of through silicon vias (TSVs) etched using the Bosch process. Accurate results are shown for TSVs with diameters of 80 μm and 25 μm.
ISSN:2380-632X
2380-6338
DOI:10.1109/IITC.2013.6615575