Bibliography of air cooled heat sinks for thermal enhancement of electronic packages

A bibliography of 847 publications dealing with air cooled heat sinks for thermal enhancement of electronic packages is presented. The bibliography also includes papers dealing with design and performance analysis of heat sinks, extended surfaces and adhesives for bonding heat sinks. The papers are...

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Bibliographische Detailangaben
1. Verfasser:	Shaukatullah, H.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Adhesives Bibliographies Bonding Electronic components Electronic packaging thermal management Electronics cooling Electronics packaging Heat sinks Microelectronics Performance analysis Thermal management of electronics
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Beschreibung
Zusammenfassung:	A bibliography of 847 publications dealing with air cooled heat sinks for thermal enhancement of electronic packages is presented. The bibliography also includes papers dealing with design and performance analysis of heat sinks, extended surfaces and adhesives for bonding heat sinks. The papers are classified in several categories.
ISSN:	1065-2221 2577-1000
DOI:	10.1109/STHERM.1998.660404