Thermal structure design for enhanced heat spreading in 3D ICs
The high efficient thermal structures are designed to resolve the heat problems in 3D ICs. The three-layers-stacked chips with the area of 10×10mm 2 and the thickness of 50μm are analyzed using the finite element method simulation tool. The heat spreaders, thermal vias, and heat paths are applied to...
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| creator | Jinwoo Jeong Seonghun Jang Woongkyu Choi Youngjae Kim Kukjin Chun |
| description | The high efficient thermal structures are designed to resolve the heat problems in 3D ICs. The three-layers-stacked chips with the area of 10×10mm 2 and the thickness of 50μm are analyzed using the finite element method simulation tool. The heat spreaders, thermal vias, and heat paths are applied to the reference stacked chips for the thermal management. The suggested thermal structure shows the results of the temperature drop of the hotspots up to 8.4°C and the reduction of the temperature gradient by 20 to 30%. |
| doi_str_mv | 10.1109/TENCONSpring.2013.6584504 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_6584504</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>6584504</ieee_id><sourcerecordid>6584504</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-f99923a5ab300227283d561723d4607b3ddd014ba404a9cd5ca1afa534e95ea33</originalsourceid><addsrcrecordid>eNo1j81OwkAURscYExV5AjfjA1DvzJ2fzsbEVFQSAgtxTS6dW1oDlcyUhW8vibj68m3OyRHiQUGhFITH1XRRLRcfh9T120KDwsLZ0lgwF2IcfKmM8-jQlOWluP0_Xl-Lcc5fAHBieHDuRjytWk572sk8pGM9HBPLyLnb9rL5TpL7lvqao2yZBpkPiSmehLLrJb7IWZXvxFVDu8zj847E5-t0Vb1P5su3WfU8n3TK22HShBA0kqUNAmjtdYnROuU1RuPAbzDGCMpsyIChUEdbk6KGLBoOlglxJO7_uB0zr0_Ve0o_63My_gLIm0uc</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Thermal structure design for enhanced heat spreading in 3D ICs</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Jinwoo Jeong ; Seonghun Jang ; Woongkyu Choi ; Youngjae Kim ; Kukjin Chun</creator><creatorcontrib>Jinwoo Jeong ; Seonghun Jang ; Woongkyu Choi ; Youngjae Kim ; Kukjin Chun</creatorcontrib><description>The high efficient thermal structures are designed to resolve the heat problems in 3D ICs. The three-layers-stacked chips with the area of 10×10mm 2 and the thickness of 50μm are analyzed using the finite element method simulation tool. The heat spreaders, thermal vias, and heat paths are applied to the reference stacked chips for the thermal management. The suggested thermal structure shows the results of the temperature drop of the hotspots up to 8.4°C and the reduction of the temperature gradient by 20 to 30%.</description><identifier>ISBN: 1467363472</identifier><identifier>ISBN: 9781467363471</identifier><identifier>EISBN: 9781467363488</identifier><identifier>EISBN: 1467363480</identifier><identifier>EISBN: 1467363499</identifier><identifier>EISBN: 9781467363495</identifier><identifier>DOI: 10.1109/TENCONSpring.2013.6584504</identifier><language>eng</language><publisher>IEEE</publisher><subject>3D IC ; Analytical models ; heat path ; heat spreader ; Heating ; Integrated circuit modeling ; Solid modeling ; Temperature distribution ; Thermal conductivity ; Thermal management ; thermal via</subject><ispartof>IEEE 2013 Tencon - Spring, 2013, p.544-547</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6584504$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>310,311,781,785,790,791,2059,27927,54922</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/6584504$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Jinwoo Jeong</creatorcontrib><creatorcontrib>Seonghun Jang</creatorcontrib><creatorcontrib>Woongkyu Choi</creatorcontrib><creatorcontrib>Youngjae Kim</creatorcontrib><creatorcontrib>Kukjin Chun</creatorcontrib><title>Thermal structure design for enhanced heat spreading in 3D ICs</title><title>IEEE 2013 Tencon - Spring</title><addtitle>TENCONSpring</addtitle><description>The high efficient thermal structures are designed to resolve the heat problems in 3D ICs. The three-layers-stacked chips with the area of 10×10mm 2 and the thickness of 50μm are analyzed using the finite element method simulation tool. The heat spreaders, thermal vias, and heat paths are applied to the reference stacked chips for the thermal management. The suggested thermal structure shows the results of the temperature drop of the hotspots up to 8.4°C and the reduction of the temperature gradient by 20 to 30%.</description><subject>3D IC</subject><subject>Analytical models</subject><subject>heat path</subject><subject>heat spreader</subject><subject>Heating</subject><subject>Integrated circuit modeling</subject><subject>Solid modeling</subject><subject>Temperature distribution</subject><subject>Thermal conductivity</subject><subject>Thermal management</subject><subject>thermal via</subject><isbn>1467363472</isbn><isbn>9781467363471</isbn><isbn>9781467363488</isbn><isbn>1467363480</isbn><isbn>1467363499</isbn><isbn>9781467363495</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2013</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo1j81OwkAURscYExV5AjfjA1DvzJ2fzsbEVFQSAgtxTS6dW1oDlcyUhW8vibj68m3OyRHiQUGhFITH1XRRLRcfh9T120KDwsLZ0lgwF2IcfKmM8-jQlOWluP0_Xl-Lcc5fAHBieHDuRjytWk572sk8pGM9HBPLyLnb9rL5TpL7lvqao2yZBpkPiSmehLLrJb7IWZXvxFVDu8zj847E5-t0Vb1P5su3WfU8n3TK22HShBA0kqUNAmjtdYnROuU1RuPAbzDGCMpsyIChUEdbk6KGLBoOlglxJO7_uB0zr0_Ve0o_63My_gLIm0uc</recordid><startdate>201304</startdate><enddate>201304</enddate><creator>Jinwoo Jeong</creator><creator>Seonghun Jang</creator><creator>Woongkyu Choi</creator><creator>Youngjae Kim</creator><creator>Kukjin Chun</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>201304</creationdate><title>Thermal structure design for enhanced heat spreading in 3D ICs</title><author>Jinwoo Jeong ; Seonghun Jang ; Woongkyu Choi ; Youngjae Kim ; Kukjin Chun</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-f99923a5ab300227283d561723d4607b3ddd014ba404a9cd5ca1afa534e95ea33</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2013</creationdate><topic>3D IC</topic><topic>Analytical models</topic><topic>heat path</topic><topic>heat spreader</topic><topic>Heating</topic><topic>Integrated circuit modeling</topic><topic>Solid modeling</topic><topic>Temperature distribution</topic><topic>Thermal conductivity</topic><topic>Thermal management</topic><topic>thermal via</topic><toplevel>online_resources</toplevel><creatorcontrib>Jinwoo Jeong</creatorcontrib><creatorcontrib>Seonghun Jang</creatorcontrib><creatorcontrib>Woongkyu Choi</creatorcontrib><creatorcontrib>Youngjae Kim</creatorcontrib><creatorcontrib>Kukjin Chun</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Jinwoo Jeong</au><au>Seonghun Jang</au><au>Woongkyu Choi</au><au>Youngjae Kim</au><au>Kukjin Chun</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Thermal structure design for enhanced heat spreading in 3D ICs</atitle><btitle>IEEE 2013 Tencon - Spring</btitle><stitle>TENCONSpring</stitle><date>2013-04</date><risdate>2013</risdate><spage>544</spage><epage>547</epage><pages>544-547</pages><isbn>1467363472</isbn><isbn>9781467363471</isbn><eisbn>9781467363488</eisbn><eisbn>1467363480</eisbn><eisbn>1467363499</eisbn><eisbn>9781467363495</eisbn><abstract>The high efficient thermal structures are designed to resolve the heat problems in 3D ICs. The three-layers-stacked chips with the area of 10×10mm 2 and the thickness of 50μm are analyzed using the finite element method simulation tool. The heat spreaders, thermal vias, and heat paths are applied to the reference stacked chips for the thermal management. The suggested thermal structure shows the results of the temperature drop of the hotspots up to 8.4°C and the reduction of the temperature gradient by 20 to 30%.</abstract><pub>IEEE</pub><doi>10.1109/TENCONSpring.2013.6584504</doi><tpages>4</tpages></addata></record> |
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| language | eng |
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| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | 3D IC Analytical models heat path heat spreader Heating Integrated circuit modeling Solid modeling Temperature distribution Thermal conductivity Thermal management thermal via |
| title | Thermal structure design for enhanced heat spreading in 3D ICs |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-18T03%3A38%3A32IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Thermal%20structure%20design%20for%20enhanced%20heat%20spreading%20in%203D%20ICs&rft.btitle=IEEE%202013%20Tencon%20-%20Spring&rft.au=Jinwoo%20Jeong&rft.date=2013-04&rft.spage=544&rft.epage=547&rft.pages=544-547&rft.isbn=1467363472&rft.isbn_list=9781467363471&rft_id=info:doi/10.1109/TENCONSpring.2013.6584504&rft_dat=%3Cieee_6IE%3E6584504%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=9781467363488&rft.eisbn_list=1467363480&rft.eisbn_list=1467363499&rft.eisbn_list=9781467363495&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=6584504&rfr_iscdi=true |