Thermal structure design for enhanced heat spreading in 3D ICs

Thermal structure design for enhanced heat spreading in 3D ICs

The high efficient thermal structures are designed to resolve the heat problems in 3D ICs. The three-layers-stacked chips with the area of 10×10mm 2 and the thickness of 50μm are analyzed using the finite element method simulation tool. The heat spreaders, thermal vias, and heat paths are applied to...

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Bibliographische Detailangaben
Hauptverfasser: Jinwoo Jeong, Seonghun Jang, Woongkyu Choi, Youngjae Kim, Kukjin Chun
Format: Tagungsbericht
Sprache:eng
Schlagworte:
3D IC
Analytical models
heat path
heat spreader
Heating
Integrated circuit modeling
Solid modeling
Temperature distribution
Thermal conductivity
Thermal management
thermal via
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Beschreibung
Zusammenfassung:The high efficient thermal structures are designed to resolve the heat problems in 3D ICs. The three-layers-stacked chips with the area of 10×10mm 2 and the thickness of 50μm are analyzed using the finite element method simulation tool. The heat spreaders, thermal vias, and heat paths are applied to the reference stacked chips for the thermal management. The suggested thermal structure shows the results of the temperature drop of the hotspots up to 8.4°C and the reduction of the temperature gradient by 20 to 30%.
DOI:10.1109/TENCONSpring.2013.6584504