TSV electrical and mechanical modeling for thermo-mechanical delamination

This paper presents the electrical modeling of thermo-mechanical delamination in TSVs, such as circumferential and interfacial cracks. Two-dimensional mechanical finite element models were built to analyze the stress distribution in TSV structures. Abaqus simulations were performed to compute the energy release rate at the crack when stress is applied and to track the propagation of cracks over different thermal cycles. The mechanical models were then translated to electrical defect models, to evaluate the electrical performance of TSVs with delaminations.