Low profile integrated passive devices with 3D high density capacitors ideal for embedded and die stacking solutions

Low profile integrated passive devices with 3D high density capacitors ideal for embedded and die stacking solutions

* The low profile IPDIA technology capability is limited by the density of the trench capacitor, more explicitly by the depth of the trench. * The 80μm Low Profile node dedicated to the highest capacitor density is qualified. * IPDIA is providing the lowest profile 3D Silicon capacitors with a super...

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Hauptverfasser: Bunel, Catherine, Pommier, Mickael, Jacqueline, Sebastien
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Pommier, Mickael
Jacqueline, Sebastien
description * The low profile IPDIA technology capability is limited by the density of the trench capacitor, more explicitly by the depth of the trench. * The 80μm Low Profile node dedicated to the highest capacitor density is qualified. * IPDIA is providing the lowest profile 3D Silicon capacitors with a superior stability and reliability over a wide temperature range. * Ideal solution where volume and weight are major concerns.
doi_str_mv 10.1109/ESTC.2012.6542168
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title Low profile integrated passive devices with 3D high density capacitors ideal for embedded and die stacking solutions
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