The world of thermal characterization according to DELPHI-Part I: Background to DELPHI

The accurate prediction of the temperatures of critical electronic parts at the package, board and system level is seriously hampered by the lack of reliable, standardized input data that characterize the thermal behaviour of these parts. The recently completed collaborative European project DELPHI...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology. Part A packaging, and manufacturing technology. Part A, 1997-12, Vol.20 (4), p.384-391
Hauptverfasser:	Rosten, H.I., Lasance, C.J.M., Parry, J.D.
Format:	Artikel
Sprache:	eng
Schlagworte:	Capacitors Collaboration Conducting materials Electronic packaging thermal management Heat sinks Prototypes Temperature Thermal conductivity Transformers Virtual manufacturing
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