Electrical design and analysis from die level to system level in advanced semiconductor engineering group

Electrical design and analysis from die level to system level in advanced semiconductor engineering group

The scope of advanced semiconductor engineering (ASE) Inc. developments on microwave field including integration passive device (IPD), system-in-package (SiP), through silicon via (TSV), signal integrity(SI) and power integrity (PI) on system level, and Co-design/Co-simulation together with device m...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Chen-Chao Wang, Ji-Han Chen, Kuo-Hua Chen, Chi-Tsung Chiu
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Co-design
Co-simulation
Integrated circuit modeling
IPD
Layout
Metals
OSD
Semiconductor device measurement
Silicon
Through-silicon vias
TSV
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Beschreibung
Zusammenfassung:The scope of advanced semiconductor engineering (ASE) Inc. developments on microwave field including integration passive device (IPD), system-in-package (SiP), through silicon via (TSV), signal integrity(SI) and power integrity (PI) on system level, and Co-design/Co-simulation together with device modeling, integrated system analysis, measurement techniques over 60GHz, and design automatic platform have been presented. In this paper, the major development techniques at ASE will be introduced.
ISSN:2165-4727
2165-4743
DOI:10.1109/APMC.2012.6421764