Room temperature debonding - An enabling technology for TSV and 3D integration

ZoneBOND TM is a revolutionary breakthrough in thin wafer processing. It enables room temperature debonding method, which is independent from the properties of the temporary adhesive. Thereby it enables a standardization of the debonding process and debonding equipment as it is material independent....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Matthias, T., Pauzenberger, G., Burggraf, J., Burgstaller, D., Lindner, P.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Adhesives Performance evaluation Stacking Temperature Through-silicon vias
Online-Zugang:	Volltext bestellen
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