Room temperature debonding - An enabling technology for TSV and 3D integration

Room temperature debonding - An enabling technology for TSV and 3D integration

ZoneBOND TM is a revolutionary breakthrough in thin wafer processing. It enables room temperature debonding method, which is independent from the properties of the temporary adhesive. Thereby it enables a standardization of the debonding process and debonding equipment as it is material independent....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Matthias, T., Pauzenberger, G., Burggraf, J., Burgstaller, D., Lindner, P.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Adhesives
Performance evaluation
Stacking
Temperature
Through-silicon vias
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Beschreibung
Zusammenfassung:ZoneBOND TM is a revolutionary breakthrough in thin wafer processing. It enables room temperature debonding method, which is independent from the properties of the temporary adhesive. Thereby it enables a standardization of the debonding process and debonding equipment as it is material independent. The ZoneBOND TM Open Platform enables a versatile supply chain with multiple adhesive suppliers.
ISSN:2150-5934
2150-5942
DOI:10.1109/IMPACT.2012.6420231