Room temperature debonding - An enabling technology for TSV and 3D integration

Room temperature debonding - An enabling technology for TSV and 3D integration

ZoneBOND TM is a revolutionary breakthrough in thin wafer processing. It enables room temperature debonding method, which is independent from the properties of the temporary adhesive. Thereby it enables a standardization of the debonding process and debonding equipment as it is material independent....

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Hauptverfasser: Matthias, T., Pauzenberger, G., Burggraf, J., Burgstaller, D., Lindner, P.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Adhesives
Performance evaluation
Stacking
Temperature
Through-silicon vias
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creator Matthias, T.
Pauzenberger, G.
Burggraf, J.
Burgstaller, D.
Lindner, P.
description ZoneBOND TM is a revolutionary breakthrough in thin wafer processing. It enables room temperature debonding method, which is independent from the properties of the temporary adhesive. Thereby it enables a standardization of the debonding process and debonding equipment as it is material independent. The ZoneBOND TM Open Platform enables a versatile supply chain with multiple adhesive suppliers.
doi_str_mv 10.1109/IMPACT.2012.6420231
format Conference Proceeding
fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_6420231</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>6420231</ieee_id><sourcerecordid>6420231</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-fc97925911fe0713a1bd5dfe279f6a470508d5024b161b3df1e12c6e61847dfc3</originalsourceid><addsrcrecordid>eNo9kMtOAkEURNtXIiJfwKZ_YMZ7-0kvCYqS4COKbknP9G0cA91kGBf8vRrRVaVycmpRjA0RSkRwV7P7p_FkUQpAURolQEg8YheojJVopLXHrCdQQ6GdEids4Ozoj2l1-s-kOmeD3e4DACQgKKl67OE55w3vaLOl1nefLfFAVU6hSSte8HHilHy1_mkd1e8pr_Nqz2Nu-eLljfsUuLzmTepo9W03OV2ys-jXOxocss9epzeLyV0xf7ydTcbzokGruyLWzjqhHWIksCg9VkGHSMK6aLyyoGEUNAhVocFKhoiEojZkcKRsiLXss-HvbkNEy23bbHy7Xx6ukV8Qj1KE</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Room temperature debonding - An enabling technology for TSV and 3D integration</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Matthias, T. ; Pauzenberger, G. ; Burggraf, J. ; Burgstaller, D. ; Lindner, P.</creator><creatorcontrib>Matthias, T. ; Pauzenberger, G. ; Burggraf, J. ; Burgstaller, D. ; Lindner, P.</creatorcontrib><description>ZoneBOND TM is a revolutionary breakthrough in thin wafer processing. It enables room temperature debonding method, which is independent from the properties of the temporary adhesive. Thereby it enables a standardization of the debonding process and debonding equipment as it is material independent. The ZoneBOND TM Open Platform enables a versatile supply chain with multiple adhesive suppliers.</description><identifier>ISSN: 2150-5934</identifier><identifier>ISBN: 9781467316354</identifier><identifier>ISBN: 1467316350</identifier><identifier>EISSN: 2150-5942</identifier><identifier>EISBN: 1467316377</identifier><identifier>EISBN: 1467316385</identifier><identifier>EISBN: 9781467316385</identifier><identifier>EISBN: 9781467316378</identifier><identifier>DOI: 10.1109/IMPACT.2012.6420231</identifier><language>eng</language><publisher>IEEE</publisher><subject>Adhesives ; Performance evaluation ; Stacking ; Temperature ; Through-silicon vias</subject><ispartof>2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012, p.46-48</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6420231$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/6420231$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Matthias, T.</creatorcontrib><creatorcontrib>Pauzenberger, G.</creatorcontrib><creatorcontrib>Burggraf, J.</creatorcontrib><creatorcontrib>Burgstaller, D.</creatorcontrib><creatorcontrib>Lindner, P.</creatorcontrib><title>Room temperature debonding - An enabling technology for TSV and 3D integration</title><title>2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</title><addtitle>IMPACT</addtitle><description>ZoneBOND TM is a revolutionary breakthrough in thin wafer processing. It enables room temperature debonding method, which is independent from the properties of the temporary adhesive. Thereby it enables a standardization of the debonding process and debonding equipment as it is material independent. The ZoneBOND TM Open Platform enables a versatile supply chain with multiple adhesive suppliers.</description><subject>Adhesives</subject><subject>Performance evaluation</subject><subject>Stacking</subject><subject>Temperature</subject><subject>Through-silicon vias</subject><issn>2150-5934</issn><issn>2150-5942</issn><isbn>9781467316354</isbn><isbn>1467316350</isbn><isbn>1467316377</isbn><isbn>1467316385</isbn><isbn>9781467316385</isbn><isbn>9781467316378</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2012</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo9kMtOAkEURNtXIiJfwKZ_YMZ7-0kvCYqS4COKbknP9G0cA91kGBf8vRrRVaVycmpRjA0RSkRwV7P7p_FkUQpAURolQEg8YheojJVopLXHrCdQQ6GdEids4Ozoj2l1-s-kOmeD3e4DACQgKKl67OE55w3vaLOl1nefLfFAVU6hSSte8HHilHy1_mkd1e8pr_Nqz2Nu-eLljfsUuLzmTepo9W03OV2ys-jXOxocss9epzeLyV0xf7ydTcbzokGruyLWzjqhHWIksCg9VkGHSMK6aLyyoGEUNAhVocFKhoiEojZkcKRsiLXss-HvbkNEy23bbHy7Xx6ukV8Qj1KE</recordid><startdate>201210</startdate><enddate>201210</enddate><creator>Matthias, T.</creator><creator>Pauzenberger, G.</creator><creator>Burggraf, J.</creator><creator>Burgstaller, D.</creator><creator>Lindner, P.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>201210</creationdate><title>Room temperature debonding - An enabling technology for TSV and 3D integration</title><author>Matthias, T. ; Pauzenberger, G. ; Burggraf, J. ; Burgstaller, D. ; Lindner, P.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-fc97925911fe0713a1bd5dfe279f6a470508d5024b161b3df1e12c6e61847dfc3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2012</creationdate><topic>Adhesives</topic><topic>Performance evaluation</topic><topic>Stacking</topic><topic>Temperature</topic><topic>Through-silicon vias</topic><toplevel>online_resources</toplevel><creatorcontrib>Matthias, T.</creatorcontrib><creatorcontrib>Pauzenberger, G.</creatorcontrib><creatorcontrib>Burggraf, J.</creatorcontrib><creatorcontrib>Burgstaller, D.</creatorcontrib><creatorcontrib>Lindner, P.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Matthias, T.</au><au>Pauzenberger, G.</au><au>Burggraf, J.</au><au>Burgstaller, D.</au><au>Lindner, P.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Room temperature debonding - An enabling technology for TSV and 3D integration</atitle><btitle>2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</btitle><stitle>IMPACT</stitle><date>2012-10</date><risdate>2012</risdate><spage>46</spage><epage>48</epage><pages>46-48</pages><issn>2150-5934</issn><eissn>2150-5942</eissn><isbn>9781467316354</isbn><isbn>1467316350</isbn><eisbn>1467316377</eisbn><eisbn>1467316385</eisbn><eisbn>9781467316385</eisbn><eisbn>9781467316378</eisbn><abstract>ZoneBOND TM is a revolutionary breakthrough in thin wafer processing. It enables room temperature debonding method, which is independent from the properties of the temporary adhesive. Thereby it enables a standardization of the debonding process and debonding equipment as it is material independent. The ZoneBOND TM Open Platform enables a versatile supply chain with multiple adhesive suppliers.</abstract><pub>IEEE</pub><doi>10.1109/IMPACT.2012.6420231</doi><tpages>3</tpages></addata></record>
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2150-5942
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subjects Adhesives
Performance evaluation
Stacking
Temperature
Through-silicon vias
title Room temperature debonding - An enabling technology for TSV and 3D integration
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T01%3A33%3A55IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Room%20temperature%20debonding%20-%20An%20enabling%20technology%20for%20TSV%20and%203D%20integration&rft.btitle=2012%207th%20International%20Microsystems,%20Packaging,%20Assembly%20and%20Circuits%20Technology%20Conference%20(IMPACT)&rft.au=Matthias,%20T.&rft.date=2012-10&rft.spage=46&rft.epage=48&rft.pages=46-48&rft.issn=2150-5934&rft.eissn=2150-5942&rft.isbn=9781467316354&rft.isbn_list=1467316350&rft_id=info:doi/10.1109/IMPACT.2012.6420231&rft_dat=%3Cieee_6IE%3E6420231%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=1467316377&rft.eisbn_list=1467316385&rft.eisbn_list=9781467316385&rft.eisbn_list=9781467316378&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=6420231&rfr_iscdi=true