Investigation of crosstalk impact on channel performance from IC package and motherboard breakout routing

Crosstalk is one of the signal integrity (SI) issues which is critical especially in systems with high operating speed and high circuit density. In this paper, the impact of crosstalk on channel performance is investigated based on the IC package and motherboard breakout routing. Differential pair spacing and coupling length were manipulated for the IC package breakout routing and motherboard breakout routing respectively. First, the crosstalk behavior on the breakout routing models are investigated in frequency and time domain. Next, the breakout routing models are used in the channel analysis, along with other components that form a channel. The crosstalk impact towards the channel is presented in terms of eye diagram parameters. Some conclusions are presented and can be used as a guideline for future circuit designers.