Bulk-Si with poly bump process scheme for MEMS sensors

Bulk-Si with poly bump process scheme for MEMS sensors

A MEMS process scheme designed for multi- sensors is presented. This new process scheme includes a poly bump not only provides stiction prevention and gap control function, and also electrical connection between MEMS structure and routing lines. Another advantage for this scheme is a better vacuum l...

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Hauptverfasser: Chun-Wen Cheng, Kai-Chih Liang, Chia-Hua Chu, Te-Hao Lee, Jiou-Kang Lee, Chung-Hsien Lin, Hsiao Chin Tuan, Kalnitsky, A., Weileun Fang, Horsley, D. A.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Accelerometers
CMOS integrated circuits
Magnetic sensors
Magnetometers
Micromechanical devices
Silicon
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Beschreibung
Zusammenfassung:A MEMS process scheme designed for multi- sensors is presented. This new process scheme includes a poly bump not only provides stiction prevention and gap control function, and also electrical connection between MEMS structure and routing lines. Another advantage for this scheme is a better vacuum level because all material can be high temperature annealed before final encapsulation. This study also demonstrated some MEMS devices using this new scheme, including resonators, accelerometers and magnetometers.
ISSN:1930-0395
2168-9229
DOI:10.1109/ICSENS.2012.6411212