Ruggedization of MXM graphics modules

Ruggedization of MXM graphics modules

MXM modules, used to package graphics processing devices for use in benign environments, have been tested for use in harsh environments typical of deployed defense and aerospace systems. Results show that specially mechanically designed MXM GP-GPU modules can survive these environments, and successf...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: Straznicky, I.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Connectors
Contacts
Electric shock
Humidity
Testing
Vehicles
Vibrations
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:MXM modules, used to package graphics processing devices for use in benign environments, have been tested for use in harsh environments typical of deployed defense and aerospace systems. Results show that specially mechanically designed MXM GP-GPU modules can survive these environments, and successfully provide the enormous processing capability offered by the latest generation of GPUs to harsh environment applications.
DOI:10.1109/HPEC.2012.6408666