Advancing high performance heterogeneous integration through die stacking

This paper describes the industry's first heterogeneous Stacked Silicon Interconnect (SSI) FPGA family (3D integration). Each device is housed in a low-temperature co-fired ceramic (LTCC) package for optimal signal integrity. Inside the package, a heterogeneous IC stack delivers up to 2.78Tb/s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Madden, L., Wu, Ephrem, Namhoon Kim, Banijamali, B., Abugharbieh, K., Ramalingam, S., Xin Wu
Format:	Tagungsbericht
Sprache:	eng ; jpn
Schlagworte:	Analytical models Field programmable gate arrays Frequency measurement Noise Silicon Substrates Transceivers
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