Measurement and field simulation based characterization of plastic IC packages

Measurement and field simulation based characterization of plastic IC packages

A method to obtain electrical models for IC packages is introduced. We used measured S-parameters to extract equivalent circuits for the package and surrounding components. The resulted equivalent circuit was verified with 3D field simulation.

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Bibliographische Detailangaben
1. Verfasser: Mernyei, F.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Bonding
Capacitance
Circuit testing
Coupling circuits
Equivalent circuits
Integrated circuit modeling
Pins
Plastic integrated circuit packaging
Scattering parameters
Semiconductor device measurement
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Beschreibung
Zusammenfassung:A method to obtain electrical models for IC packages is introduced. We used measured S-parameters to extract equivalent circuits for the package and surrounding components. The resulted equivalent circuit was verified with 3D field simulation.
DOI:10.1109/EPEP.1997.634066