ESD measurement methods for carrier tape packing material for ESDS semiconductor device
Today, it is commonly assumed that carrier tape top surface resistance is equivalent to resistance in carrier tape pockets and also that there is always continuity between pockets and tape body. This article explains why these assumptions are incorrect and an alternative method of measurement is pro...
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creator | Shih Ming Lee |
description | Today, it is commonly assumed that carrier tape top surface resistance is equivalent to resistance in carrier tape pockets and also that there is always continuity between pockets and tape body. This article explains why these assumptions are incorrect and an alternative method of measurement is proposed. |
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This article explains why these assumptions are incorrect and an alternative method of measurement is proposed.</description><subject>Electrical resistance measurement</subject><subject>Electrostatic discharges</subject><subject>Immune system</subject><subject>Pins</subject><subject>Probes</subject><subject>Surface resistance</subject><issn>0739-5159</issn><issn>2164-9340</issn><isbn>1467314676</isbn><isbn>9781467314671</isbn><isbn>9781585372102</isbn><isbn>1585372102</isbn><isbn>9781585372188</isbn><isbn>1585372188</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2012</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotTMlOAzEUC5tEKfMFXPIDI2VfjqiURarEoSCO1UvyBgKdRZkpEn_PsPhgW5btI1J567h2WlrBmTgmC8GNqr1U7IRccGWs_CFzShbMSl9rrv05qcbxnc1w3HHpFuRlvb2hLcJ4KNhiN81-euvTSJu-0AilZCx0ggHpAPEjd6-0hQlLhv1vY15v6Yhtjn2XDnGao4SfOeIlOWtgP2L1r0vyfLt-Wt3Xm8e7h9X1ps7c6qluvA9MRZGYFDH6kCJTTPHYOA42QFAJE7CQUgOBOycMmGiddiEwDE4ZuSRXf78ZEXdDyS2Ur52RM7SR307BUjE</recordid><startdate>201209</startdate><enddate>201209</enddate><creator>Shih Ming Lee</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>201209</creationdate><title>ESD measurement methods for carrier tape packing material for ESDS semiconductor device</title><author>Shih Ming Lee</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-f99b04c2d032cc9bdc04041cf81a7bab4deda0bddfab18826a6c7858bb0eb8463</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2012</creationdate><topic>Electrical resistance measurement</topic><topic>Electrostatic discharges</topic><topic>Immune system</topic><topic>Pins</topic><topic>Probes</topic><topic>Surface resistance</topic><toplevel>online_resources</toplevel><creatorcontrib>Shih Ming Lee</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Shih Ming Lee</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>ESD measurement methods for carrier tape packing material for ESDS semiconductor device</atitle><btitle>Electrical Overstress / Electrostatic Discharge Symposium Proceedings 2012</btitle><stitle>EOSESD</stitle><date>2012-09</date><risdate>2012</risdate><spage>1</spage><epage>10</epage><pages>1-10</pages><issn>0739-5159</issn><eissn>2164-9340</eissn><isbn>1467314676</isbn><isbn>9781467314671</isbn><eisbn>9781585372102</eisbn><eisbn>1585372102</eisbn><eisbn>9781585372188</eisbn><eisbn>1585372188</eisbn><abstract>Today, it is commonly assumed that carrier tape top surface resistance is equivalent to resistance in carrier tape pockets and also that there is always continuity between pockets and tape body. This article explains why these assumptions are incorrect and an alternative method of measurement is proposed.</abstract><pub>IEEE</pub><tpages>10</tpages></addata></record> |
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ispartof | Electrical Overstress / Electrostatic Discharge Symposium Proceedings 2012, 2012, p.1-10 |
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source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Electrical resistance measurement Electrostatic discharges Immune system Pins Probes Surface resistance |
title | ESD measurement methods for carrier tape packing material for ESDS semiconductor device |
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