ESD measurement methods for carrier tape packing material for ESDS semiconductor device

Today, it is commonly assumed that carrier tape top surface resistance is equivalent to resistance in carrier tape pockets and also that there is always continuity between pockets and tape body. This article explains why these assumptions are incorrect and an alternative method of measurement is pro...

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description Today, it is commonly assumed that carrier tape top surface resistance is equivalent to resistance in carrier tape pockets and also that there is always continuity between pockets and tape body. This article explains why these assumptions are incorrect and an alternative method of measurement is proposed.
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fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_6333356</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>6333356</ieee_id><sourcerecordid>6333356</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-f99b04c2d032cc9bdc04041cf81a7bab4deda0bddfab18826a6c7858bb0eb8463</originalsourceid><addsrcrecordid>eNotTMlOAzEUC5tEKfMFXPIDI2VfjqiURarEoSCO1UvyBgKdRZkpEn_PsPhgW5btI1J567h2WlrBmTgmC8GNqr1U7IRccGWs_CFzShbMSl9rrv05qcbxnc1w3HHpFuRlvb2hLcJ4KNhiN81-euvTSJu-0AilZCx0ggHpAPEjd6-0hQlLhv1vY15v6Yhtjn2XDnGao4SfOeIlOWtgP2L1r0vyfLt-Wt3Xm8e7h9X1ps7c6qluvA9MRZGYFDH6kCJTTPHYOA42QFAJE7CQUgOBOycMmGiddiEwDE4ZuSRXf78ZEXdDyS2Ur52RM7SR307BUjE</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>ESD measurement methods for carrier tape packing material for ESDS semiconductor device</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Shih Ming Lee</creator><creatorcontrib>Shih Ming Lee</creatorcontrib><description>Today, it is commonly assumed that carrier tape top surface resistance is equivalent to resistance in carrier tape pockets and also that there is always continuity between pockets and tape body. This article explains why these assumptions are incorrect and an alternative method of measurement is proposed.</description><identifier>ISSN: 0739-5159</identifier><identifier>ISBN: 1467314676</identifier><identifier>ISBN: 9781467314671</identifier><identifier>EISSN: 2164-9340</identifier><identifier>EISBN: 9781585372102</identifier><identifier>EISBN: 1585372102</identifier><identifier>EISBN: 9781585372188</identifier><identifier>EISBN: 1585372188</identifier><language>eng</language><publisher>IEEE</publisher><subject>Electrical resistance measurement ; Electrostatic discharges ; Immune system ; Pins ; Probes ; Surface resistance</subject><ispartof>Electrical Overstress / Electrostatic Discharge Symposium Proceedings 2012, 2012, p.1-10</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6333356$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/6333356$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Shih Ming Lee</creatorcontrib><title>ESD measurement methods for carrier tape packing material for ESDS semiconductor device</title><title>Electrical Overstress / Electrostatic Discharge Symposium Proceedings 2012</title><addtitle>EOSESD</addtitle><description>Today, it is commonly assumed that carrier tape top surface resistance is equivalent to resistance in carrier tape pockets and also that there is always continuity between pockets and tape body. This article explains why these assumptions are incorrect and an alternative method of measurement is proposed.</description><subject>Electrical resistance measurement</subject><subject>Electrostatic discharges</subject><subject>Immune system</subject><subject>Pins</subject><subject>Probes</subject><subject>Surface resistance</subject><issn>0739-5159</issn><issn>2164-9340</issn><isbn>1467314676</isbn><isbn>9781467314671</isbn><isbn>9781585372102</isbn><isbn>1585372102</isbn><isbn>9781585372188</isbn><isbn>1585372188</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2012</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotTMlOAzEUC5tEKfMFXPIDI2VfjqiURarEoSCO1UvyBgKdRZkpEn_PsPhgW5btI1J567h2WlrBmTgmC8GNqr1U7IRccGWs_CFzShbMSl9rrv05qcbxnc1w3HHpFuRlvb2hLcJ4KNhiN81-euvTSJu-0AilZCx0ggHpAPEjd6-0hQlLhv1vY15v6Yhtjn2XDnGao4SfOeIlOWtgP2L1r0vyfLt-Wt3Xm8e7h9X1ps7c6qluvA9MRZGYFDH6kCJTTPHYOA42QFAJE7CQUgOBOycMmGiddiEwDE4ZuSRXf78ZEXdDyS2Ur52RM7SR307BUjE</recordid><startdate>201209</startdate><enddate>201209</enddate><creator>Shih Ming Lee</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>201209</creationdate><title>ESD measurement methods for carrier tape packing material for ESDS semiconductor device</title><author>Shih Ming Lee</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-f99b04c2d032cc9bdc04041cf81a7bab4deda0bddfab18826a6c7858bb0eb8463</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2012</creationdate><topic>Electrical resistance measurement</topic><topic>Electrostatic discharges</topic><topic>Immune system</topic><topic>Pins</topic><topic>Probes</topic><topic>Surface resistance</topic><toplevel>online_resources</toplevel><creatorcontrib>Shih Ming Lee</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Shih Ming Lee</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>ESD measurement methods for carrier tape packing material for ESDS semiconductor device</atitle><btitle>Electrical Overstress / Electrostatic Discharge Symposium Proceedings 2012</btitle><stitle>EOSESD</stitle><date>2012-09</date><risdate>2012</risdate><spage>1</spage><epage>10</epage><pages>1-10</pages><issn>0739-5159</issn><eissn>2164-9340</eissn><isbn>1467314676</isbn><isbn>9781467314671</isbn><eisbn>9781585372102</eisbn><eisbn>1585372102</eisbn><eisbn>9781585372188</eisbn><eisbn>1585372188</eisbn><abstract>Today, it is commonly assumed that carrier tape top surface resistance is equivalent to resistance in carrier tape pockets and also that there is always continuity between pockets and tape body. This article explains why these assumptions are incorrect and an alternative method of measurement is proposed.</abstract><pub>IEEE</pub><tpages>10</tpages></addata></record>
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identifier ISSN: 0739-5159
ispartof Electrical Overstress / Electrostatic Discharge Symposium Proceedings 2012, 2012, p.1-10
issn 0739-5159
2164-9340
language eng
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Electrical resistance measurement
Electrostatic discharges
Immune system
Pins
Probes
Surface resistance
title ESD measurement methods for carrier tape packing material for ESDS semiconductor device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-02T18%3A23%3A42IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=ESD%20measurement%20methods%20for%20carrier%20tape%20packing%20material%20for%20ESDS%20semiconductor%20device&rft.btitle=Electrical%20Overstress%20/%20Electrostatic%20Discharge%20Symposium%20Proceedings%202012&rft.au=Shih%20Ming%20Lee&rft.date=2012-09&rft.spage=1&rft.epage=10&rft.pages=1-10&rft.issn=0739-5159&rft.eissn=2164-9340&rft.isbn=1467314676&rft.isbn_list=9781467314671&rft_id=info:doi/&rft_dat=%3Cieee_6IE%3E6333356%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=9781585372102&rft.eisbn_list=1585372102&rft.eisbn_list=9781585372188&rft.eisbn_list=1585372188&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=6333356&rfr_iscdi=true