Behaviors of flexible vertically aligned carbon nanotube bumps under compression

In this research, bump-shaped Vertically Aligned Mutli-walled Carbon Nanotubes (VACNTs) were bonded to Au substrate as flip-chip interconnect, and the behaviors of the VACNT bumps under compression pressure were studied. In this model, it is considered that the VACNTs were deformed permanently by th...

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Bibliographische Detailangaben

Hauptverfasser:	Fujino, M., Terasaka, H., Suga, T., Soga, I., Kondo, D., Ishizuki, Y., Iwai, T.
Format:	Tagungsbericht
Sprache:	eng ; jpn
Schlagworte:	Bonding Gold Image coding Substrates
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