Behaviors of flexible vertically aligned carbon nanotube bumps under compression

In this research, bump-shaped Vertically Aligned Mutli-walled Carbon Nanotubes (VACNTs) were bonded to Au substrate as flip-chip interconnect, and the behaviors of the VACNT bumps under compression pressure were studied. In this model, it is considered that the VACNTs were deformed permanently by the friction among the VACNTs. In order to solve the cause of the permanent deformation of the VACNT bumps, the friction among the CNTs during the compression is calculated. Furthermore, the resistance of the VACNT bumps is measured, considering the amount of the deformation of the VACNT bumps.