Ultralow EMI interconnection module for mobile devices using 3D-flexible hybrid multi-fin optoelectronic FPC

An optoelectronic interconnection module for mobile devices is required to have not only optical interconnection for high-speed and noise-free signal transmission but also many electrical wirings for multiple power supplies and low-speed signal transmission. It leads to great challenges of cost incr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Uemura, H., Kobayashi, K., Hiyama, K., Furuyama, H., Sugizaki, Y., Shibata, H.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Electromagnetic interference High speed optical techniques Integrated circuit interconnections Integrated optics Mobile handsets Optical device fabrication Optical interconnections
Online-Zugang:	Volltext bestellen
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