Ultralow EMI interconnection module for mobile devices using 3D-flexible hybrid multi-fin optoelectronic FPC

An optoelectronic interconnection module for mobile devices is required to have not only optical interconnection for high-speed and noise-free signal transmission but also many electrical wirings for multiple power supplies and low-speed signal transmission. It leads to great challenges of cost increase, flexibility degradation and electromagnetic noise emission. We propose a novel optoelectronic interconnection module for mobile devices in this paper. A hybrid configuration of an optoelectronic flexible printed circuit (OE-FPC) and an electrical FPC enables to minimize the cost, and a multi-fin structure fabricated by splitting the interconnection area realizes 3D flexibility which is not feasible with a conventional FPC. Magnetic near-field intensities of the optoelectronic interconnection module for mobile devices are shown for the first time. An ultralow-power and ultralow electromagnetic interference (EMI) optical signal transmission performance is demonstrated. It proves that the module developed in this work is highly promising for mobile devices in which signal integrity and EMI are growing into serious problems.