A 77GHz automotive radar receiver in a wafer level package
In this paper, a 77-GHz radar receiver is presented, which comes in a wafer level package and thus eliminates the need for wire bonding yielding significant cost reduction. The high integration level available in the productive Silicon-Germanium (SiGe) technology used in this paper allows for implem...
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| creator | Wagner, C. Bock, J. Wojnowski, M. Jager, H. Platz, J. Treml, M. Dober, F. Lachner, R. Minichshofer, J. Maurer, L. |
| description | In this paper, a 77-GHz radar receiver is presented, which comes in a wafer level package and thus eliminates the need for wire bonding yielding significant cost reduction. The high integration level available in the productive Silicon-Germanium (SiGe) technology used in this paper allows for implementation of in-system monitoring of the receiver conversion parameters. This facilitates the realization of ISO 26262 compliant radar sensors for automotive safety applications. |
| doi_str_mv | 10.1109/RFIC.2012.6242334 |
| format | Conference Proceeding |
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| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 1529-2517 |
| ispartof | 2012 IEEE Radio Frequency Integrated Circuits Symposium, 2012, p.511-514 |
| issn | 1529-2517 2375-0995 |
| language | eng |
| recordid | cdi_ieee_primary_6242334 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | 77-GHz Automotive engineering automotive radar BITE eWLB package Radar Radio frequency Receivers Sensors SiGe technology Silicon Silicon germanium |
| title | A 77GHz automotive radar receiver in a wafer level package |
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