A 77GHz automotive radar receiver in a wafer level package

In this paper, a 77-GHz radar receiver is presented, which comes in a wafer level package and thus eliminates the need for wire bonding yielding significant cost reduction. The high integration level available in the productive Silicon-Germanium (SiGe) technology used in this paper allows for implem...

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Bibliographische Detailangaben
Hauptverfasser: Wagner, C., Bock, J., Wojnowski, M., Jager, H., Platz, J., Treml, M., Dober, F., Lachner, R., Minichshofer, J., Maurer, L.
Format: Tagungsbericht
Sprache:eng
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Beschreibung
Zusammenfassung:In this paper, a 77-GHz radar receiver is presented, which comes in a wafer level package and thus eliminates the need for wire bonding yielding significant cost reduction. The high integration level available in the productive Silicon-Germanium (SiGe) technology used in this paper allows for implementation of in-system monitoring of the receiver conversion parameters. This facilitates the realization of ISO 26262 compliant radar sensors for automotive safety applications.
ISSN:1529-2517
2375-0995
DOI:10.1109/RFIC.2012.6242334