Effective line length of test structure and its effect of area scaling on TDDB characterization in advanced Cu/ULK process

This study focuses on the cause of deviation of Poisson area scaling trend used for IMD-TDDB reliability of Cu/ULK (k=2.55) process. The effects of test structure, such as the serpent-comb and comb-comb structure, on IMD-TDDB reliability are comprehensively investigated with a simple resistance model to illustrate voltage drop and effective length of metal line. Since effective line length of the serpentine-comb decreases with increasing voltage so as to misread lifetime prediction, care must be taken in the selection of test structure and bias condition for advanced BEOL process development with ULK and its reliability qualification.