Wafer-level heterogeneous 3D integration for MEMS and NEMS

In this paper the state-of-the-art in wafer-level heterogeneous 3D integration technologies for micro-electromechanical systems (MEMS) and nano-electromechanical systems (NEMS) is reviewed. Various examples of commercial and experimental heterogeneous 3D integration processes for MEMS and NEMS devic...

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Hauptverfasser:	Niklaus, Frank, Lapisa, M., Bleiker, S. J., Dubois, V., Roxhed, N., Fischer, A. C., Forsberg, F., Stemme, G., Grogg, D., Despont, M.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Arrays CMOS integrated circuits MEMS microelectromechanical system Micromechanical devices Mirrors More-than-Moore nano-electromechanical system Nanoelectromechanical systems NEMS self-assembly Silicon Substrates transfer printing wafer-level heterogeneous integration
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Beschreibung
Zusammenfassung:	In this paper the state-of-the-art in wafer-level heterogeneous 3D integration technologies for micro-electromechanical systems (MEMS) and nano-electromechanical systems (NEMS) is reviewed. Various examples of commercial and experimental heterogeneous 3D integration processes for MEMS and NEMS devices are presented and discussed.
DOI:	10.1109/LTB-3D.2012.6238096