Low temperature metal and polymer bonding for advanced infrared imaging sensors

Low temperature bonding is a critical process module for high density 3-D integration technology as well as wafer-level 3-D packaging. This presentation will review the use of such 3-D integration technologies in advanced infrared imaging sensors. Designs based on 3-D architectures enable infrared cameras that are characterized by high performance, low power, low weight and a small form factor. Such cameras are expected to be used widely in defense, security and commercial markets. The presentation will highlight recent 3-D integration technology demonstrations at RTI that employ low temperature metal and polymer bonding. We have demonstrated 99.99% operability in large arrays of 3-D interconnects with pitches down to 10 μm.