Bonding wire current measurement with tiny film current sensors

Bonding wire current measurement with tiny film current sensors

Bonding wire current measurement technique has been highly desired to analyze failure phenomena, such as short circuit and avalanche destruction of IGBT and power diode. This paper challenged to measure bonding wire current distribution in an IGBT module with the multiple tiny film current sensors a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Hirai, H., Kasho, Y., Tsukuda, M., Omura, I.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Bonding
bonding wire current mesurement
Coils
Current measurement
digital calculation technique
film current sensor with tiny-scale coils
high speed analog amplifiers
Magnetic sensors
Wires
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Bonding wire current measurement technique has been highly desired to analyze failure phenomena, such as short circuit and avalanche destruction of IGBT and power diode. This paper challenged to measure bonding wire current distribution in an IGBT module with the multiple tiny film current sensors and the digital calculation technique. The authors successfully measured bonding wire current under a single shot measurement.
ISSN:1063-6854
1946-0201
DOI:10.1109/ISPSD.2012.6229079