Modeling the effect of phosphorus dose loss at the SiO/sub 2/ interface on CMOS device characteristics

A model for the phosphorus dose loss effect is developed and incorporated into the process simulator PROPHET. The dose loss model is applied consistently with the Transient Enhanced Diffusion and the segregation models in PROPHET to provide doping profiles used by the device simulator PADRE in simul...

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Hauptverfasser: Vuong, H.-H., Rafferty, C.S., McMacken, J.R., Ning, J., Chaudhry, S.
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creator Vuong, H.-H.
Rafferty, C.S.
McMacken, J.R.
Ning, J.
Chaudhry, S.
description A model for the phosphorus dose loss effect is developed and incorporated into the process simulator PROPHET. The dose loss model is applied consistently with the Transient Enhanced Diffusion and the segregation models in PROPHET to provide doping profiles used by the device simulator PADRE in simulations of NMOS, PMOS, and isolation structures for actual VLSI technologies. Comparison of the simulated and measured device characteristics and their dependence on substrate bias and structure geometry shows good agreement, and furthermore highlights the importance of the dose loss phenomenon in these structures.
doi_str_mv 10.1109/SISPAD.1997.621342
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fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_621342</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>621342</ieee_id><sourcerecordid>621342</sourcerecordid><originalsourceid>FETCH-ieee_primary_6213423</originalsourceid><addsrcrecordid>eNp9Ts2KwjAYDCyCi_YFPH0vsG3SVGuP4g96EIXuXbLpFxvpNpIvLuzbG9SzwwzDMHMYxiaCp0LwKqt39XGxSkVVleksF7LIP1hSlXMeKWVZTmdDlhBdeERRTGXOP5nZuwY7258htAhoDOoAzsC1dRTlbwSNI4TOEYEKj1VtDxndfiDPwPYBvVEawfWw3B9qaPDPxqhb5ZWOpaVgNY3ZwKiOMHn5iE026-_l9ssi4unq7a_y_6fnafm2vAMKX0ZL</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Modeling the effect of phosphorus dose loss at the SiO/sub 2/ interface on CMOS device characteristics</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Vuong, H.-H. ; Rafferty, C.S. ; McMacken, J.R. ; Ning, J. ; Chaudhry, S.</creator><creatorcontrib>Vuong, H.-H. ; Rafferty, C.S. ; McMacken, J.R. ; Ning, J. ; Chaudhry, S.</creatorcontrib><description>A model for the phosphorus dose loss effect is developed and incorporated into the process simulator PROPHET. The dose loss model is applied consistently with the Transient Enhanced Diffusion and the segregation models in PROPHET to provide doping profiles used by the device simulator PADRE in simulations of NMOS, PMOS, and isolation structures for actual VLSI technologies. Comparison of the simulated and measured device characteristics and their dependence on substrate bias and structure geometry shows good agreement, and furthermore highlights the importance of the dose loss phenomenon in these structures.</description><identifier>ISBN: 9780780337756</identifier><identifier>ISBN: 0780337751</identifier><identifier>DOI: 10.1109/SISPAD.1997.621342</identifier><language>eng</language><publisher>IEEE</publisher><subject>Annealing ; CMOS technology ; Doping profiles ; Implants ; MOS devices ; Oxidation ; Partial differential equations ; Semiconductor device modeling ; Semiconductor process modeling ; Silicon</subject><ispartof>SISPAD '97. 1997 International Conference on Simulation of Semiconductor Processes and Devices. Technical Digest, 1997, p.85-88</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/621342$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2051,4035,4036,27904,54899</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/621342$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Vuong, H.-H.</creatorcontrib><creatorcontrib>Rafferty, C.S.</creatorcontrib><creatorcontrib>McMacken, J.R.</creatorcontrib><creatorcontrib>Ning, J.</creatorcontrib><creatorcontrib>Chaudhry, S.</creatorcontrib><title>Modeling the effect of phosphorus dose loss at the SiO/sub 2/ interface on CMOS device characteristics</title><title>SISPAD '97. 1997 International Conference on Simulation of Semiconductor Processes and Devices. Technical Digest</title><addtitle>SISPAD</addtitle><description>A model for the phosphorus dose loss effect is developed and incorporated into the process simulator PROPHET. The dose loss model is applied consistently with the Transient Enhanced Diffusion and the segregation models in PROPHET to provide doping profiles used by the device simulator PADRE in simulations of NMOS, PMOS, and isolation structures for actual VLSI technologies. Comparison of the simulated and measured device characteristics and their dependence on substrate bias and structure geometry shows good agreement, and furthermore highlights the importance of the dose loss phenomenon in these structures.</description><subject>Annealing</subject><subject>CMOS technology</subject><subject>Doping profiles</subject><subject>Implants</subject><subject>MOS devices</subject><subject>Oxidation</subject><subject>Partial differential equations</subject><subject>Semiconductor device modeling</subject><subject>Semiconductor process modeling</subject><subject>Silicon</subject><isbn>9780780337756</isbn><isbn>0780337751</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1997</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNp9Ts2KwjAYDCyCi_YFPH0vsG3SVGuP4g96EIXuXbLpFxvpNpIvLuzbG9SzwwzDMHMYxiaCp0LwKqt39XGxSkVVleksF7LIP1hSlXMeKWVZTmdDlhBdeERRTGXOP5nZuwY7258htAhoDOoAzsC1dRTlbwSNI4TOEYEKj1VtDxndfiDPwPYBvVEawfWw3B9qaPDPxqhb5ZWOpaVgNY3ZwKiOMHn5iE026-_l9ssi4unq7a_y_6fnafm2vAMKX0ZL</recordid><startdate>1997</startdate><enddate>1997</enddate><creator>Vuong, H.-H.</creator><creator>Rafferty, C.S.</creator><creator>McMacken, J.R.</creator><creator>Ning, J.</creator><creator>Chaudhry, S.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>1997</creationdate><title>Modeling the effect of phosphorus dose loss at the SiO/sub 2/ interface on CMOS device characteristics</title><author>Vuong, H.-H. ; Rafferty, C.S. ; McMacken, J.R. ; Ning, J. ; Chaudhry, S.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-ieee_primary_6213423</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>1997</creationdate><topic>Annealing</topic><topic>CMOS technology</topic><topic>Doping profiles</topic><topic>Implants</topic><topic>MOS devices</topic><topic>Oxidation</topic><topic>Partial differential equations</topic><topic>Semiconductor device modeling</topic><topic>Semiconductor process modeling</topic><topic>Silicon</topic><toplevel>online_resources</toplevel><creatorcontrib>Vuong, H.-H.</creatorcontrib><creatorcontrib>Rafferty, C.S.</creatorcontrib><creatorcontrib>McMacken, J.R.</creatorcontrib><creatorcontrib>Ning, J.</creatorcontrib><creatorcontrib>Chaudhry, S.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Vuong, H.-H.</au><au>Rafferty, C.S.</au><au>McMacken, J.R.</au><au>Ning, J.</au><au>Chaudhry, S.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Modeling the effect of phosphorus dose loss at the SiO/sub 2/ interface on CMOS device characteristics</atitle><btitle>SISPAD '97. 1997 International Conference on Simulation of Semiconductor Processes and Devices. Technical Digest</btitle><stitle>SISPAD</stitle><date>1997</date><risdate>1997</risdate><spage>85</spage><epage>88</epage><pages>85-88</pages><isbn>9780780337756</isbn><isbn>0780337751</isbn><abstract>A model for the phosphorus dose loss effect is developed and incorporated into the process simulator PROPHET. The dose loss model is applied consistently with the Transient Enhanced Diffusion and the segregation models in PROPHET to provide doping profiles used by the device simulator PADRE in simulations of NMOS, PMOS, and isolation structures for actual VLSI technologies. Comparison of the simulated and measured device characteristics and their dependence on substrate bias and structure geometry shows good agreement, and furthermore highlights the importance of the dose loss phenomenon in these structures.</abstract><pub>IEEE</pub><doi>10.1109/SISPAD.1997.621342</doi></addata></record>
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Annealing
CMOS technology
Doping profiles
Implants
MOS devices
Oxidation
Partial differential equations
Semiconductor device modeling
Semiconductor process modeling
Silicon
title Modeling the effect of phosphorus dose loss at the SiO/sub 2/ interface on CMOS device characteristics
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-21T12%3A20%3A28IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Modeling%20the%20effect%20of%20phosphorus%20dose%20loss%20at%20the%20SiO/sub%202/%20interface%20on%20CMOS%20device%20characteristics&rft.btitle=SISPAD%20'97.%201997%20International%20Conference%20on%20Simulation%20of%20Semiconductor%20Processes%20and%20Devices.%20Technical%20Digest&rft.au=Vuong,%20H.-H.&rft.date=1997&rft.spage=85&rft.epage=88&rft.pages=85-88&rft.isbn=9780780337756&rft.isbn_list=0780337751&rft_id=info:doi/10.1109/SISPAD.1997.621342&rft_dat=%3Cieee_6IE%3E621342%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=621342&rfr_iscdi=true