An adhesion strength measurement method for particle transfer and assembly in dry environment

An adhesion strength measurement method for particle transfer and assembly in dry environment

This research presents a new and noncontact method to measure the adhesion strength between micro-particles and substrates in parallel. It is cost effective and time saving. In this study, the adhesion strength between micro solder ball and PDMS (polydimethylsiloxane) and ReproRubber ® (polymethylhy...

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Bibliographische Detailangaben
Hauptverfasser: Sho-Fu Wang, Yen-Ting Lin, Yan-Bo Lin, Wang, Kerwin
Format: Tagungsbericht
Sprache:eng
Schlagworte:
adhesion
adhesive strength
Assembly
Atmospheric measurements
flip-chip
Nanoelectromechanical systems
Optical imaging
Particle measurements
PDMS
Semiconductor device measurement
Substrates
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Beschreibung
Zusammenfassung:This research presents a new and noncontact method to measure the adhesion strength between micro-particles and substrates in parallel. It is cost effective and time saving. In this study, the adhesion strength between micro solder ball and PDMS (polydimethylsiloxane) and ReproRubber ® (polymethylhylhydrogen) are investigated. The setup is capable of evaluating more than 8 particles separately each run. The experiment results indicated that the adhesion strength is highly dependent on surface conditions, parts geometry and material properties. The testing results also have been applied to successive parts transferring and assembling.
DOI:10.1109/NEMS.2012.6196792