Heterojunction with intrinsic thin layer (HIT) solar cell under mechanical bending
The strain distribution and electrical characteristics of heterojunction with intrinsic thin layer (HIT) solar cell with mechanical bending was studied in this work. The efficiency decreased with mechanical strain increasing due to bandgap narrowing. The advantage of wafer thin down for HIT is not o...
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creator | Lee, M. H. Chang, S. T. Tai, C.-W Shen, J.-D Lee, C.-C |
description | The strain distribution and electrical characteristics of heterojunction with intrinsic thin layer (HIT) solar cell with mechanical bending was studied in this work. The efficiency decreased with mechanical strain increasing due to bandgap narrowing. The advantage of wafer thin down for HIT is not only decreasing electron-hole recombination, but also reducing variation of performance with mechanical strains. |
doi_str_mv | 10.1109/PVSC.2011.6186550 |
format | Conference Proceeding |
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H. ; Chang, S. T. ; Tai, C.-W ; Shen, J.-D ; Lee, C.-C</creator><creatorcontrib>Lee, M. H. ; Chang, S. T. ; Tai, C.-W ; Shen, J.-D ; Lee, C.-C</creatorcontrib><description>The strain distribution and electrical characteristics of heterojunction with intrinsic thin layer (HIT) solar cell with mechanical bending was studied in this work. The efficiency decreased with mechanical strain increasing due to bandgap narrowing. 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The advantage of wafer thin down for HIT is not only decreasing electron-hole recombination, but also reducing variation of performance with mechanical strains.</description><subject>Educational institutions</subject><subject>Electric variables</subject><subject>Photonic band gap</subject><subject>Photovoltaic cells</subject><subject>Semiconductor device modeling</subject><subject>Strain</subject><subject>Stress</subject><issn>0160-8371</issn><isbn>9781424499663</isbn><isbn>1424499666</isbn><isbn>9781424499649</isbn><isbn>142449964X</isbn><isbn>9781424499656</isbn><isbn>1424499658</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2011</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpVUM1KxDAYjKjgsvYBxEuOemjNf5ujFHUXFhQtXpc0-WKzdFNps8i-vQX34sxhmBmYwyB0Q0lBKdEPb58fdcEIpYWilZKSnKFMlxUVTAitldDn_7ziF2hBqCJ5xUt6hbJp2pEZJeFzt0DvK0gwDrtDtCkMEf-E1OEQ0xjiFCxOXYi4N0cY8d1q3dzjaejNiC30PT5EN8d7sJ2JwZoetxBdiF_X6NKbfoLspEvUPD819SrfvL6s68dNHjRJuWOlU2AZFa3k3vlWKdV6UB6M0AaolF4CmVPgglWOcSlmagnKiJZbzZfo9m82AMD2ewx7Mx63p1P4LwqeU5g</recordid><startdate>201106</startdate><enddate>201106</enddate><creator>Lee, M. 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T.</creatorcontrib><creatorcontrib>Tai, C.-W</creatorcontrib><creatorcontrib>Shen, J.-D</creatorcontrib><creatorcontrib>Lee, C.-C</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Lee, M. H.</au><au>Chang, S. T.</au><au>Tai, C.-W</au><au>Shen, J.-D</au><au>Lee, C.-C</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Heterojunction with intrinsic thin layer (HIT) solar cell under mechanical bending</atitle><btitle>2011 37th IEEE Photovoltaic Specialists Conference</btitle><stitle>PVSC</stitle><date>2011-06</date><risdate>2011</risdate><spage>002891</spage><epage>002893</epage><pages>002891-002893</pages><issn>0160-8371</issn><isbn>9781424499663</isbn><isbn>1424499666</isbn><eisbn>9781424499649</eisbn><eisbn>142449964X</eisbn><eisbn>9781424499656</eisbn><eisbn>1424499658</eisbn><abstract>The strain distribution and electrical characteristics of heterojunction with intrinsic thin layer (HIT) solar cell with mechanical bending was studied in this work. The efficiency decreased with mechanical strain increasing due to bandgap narrowing. The advantage of wafer thin down for HIT is not only decreasing electron-hole recombination, but also reducing variation of performance with mechanical strains.</abstract><pub>IEEE</pub><doi>10.1109/PVSC.2011.6186550</doi><tpages>3</tpages></addata></record> |
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ispartof | 2011 37th IEEE Photovoltaic Specialists Conference, 2011, p.002891-002893 |
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language | eng |
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source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Educational institutions Electric variables Photonic band gap Photovoltaic cells Semiconductor device modeling Strain Stress |
title | Heterojunction with intrinsic thin layer (HIT) solar cell under mechanical bending |
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