Stacking of Known Good Reconstructed Wafer without TSV applications to memory-only and heterogeneous SiP

Stacking of Known Good Reconstructed Wafer without TSV applications to memory-only and heterogeneous SiP

A technological break based on Wafer Level Package started in 2002, consists in only stacking Known Good Reconstructed Wafer (what Freescale named: RCP and Infineon named eWLB) instead of standard wafers. This approach allows to have a very good yield, on the contrary of the W2W with TSV technologie...

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Bibliographische Detailangaben
Hauptverfasser: Val, C., Noiray, P. C. J., Boulay, N.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Electronics packaging
Mechanical sensors
Pacemakers
Stacking
Three dimensional displays
Through-silicon vias
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Beschreibung
Zusammenfassung:A technological break based on Wafer Level Package started in 2002, consists in only stacking Known Good Reconstructed Wafer (what Freescale named: RCP and Infineon named eWLB) instead of standard wafers. This approach allows to have a very good yield, on the contrary of the W2W with TSV technologies. Several applications will be presented on the medical area, industrial area and smart card area.
DOI:10.1109/EPTC.2011.6184466