High thermal performance ICP die attach process design and development for LQFP-EP

Many semiconductor devices require very high thermal performance, especially the automotive industry. Die attach material selection is a critical segment for achieving high thermal performance and stringent reliability requirements. The stringent reliability requirement at high temperature and long operating hour test is needed to test the robustness of the device and its package. Typically, solder interconnect is a more suitable candidate to meet the high temperature and long test cycle. While it is known that a metal to metal connection is sustainable at high temperatures, for certain packages, design limitations and cost advantages are the driving forces for development of epoxy type die attach materials.