Novel packaging technique and its application to a wet/wet differential pressure silicon sensor

Novel packaging technique and its application to a wet/wet differential pressure silicon sensor

The packaging technique presented provides direct interaction between the sensing element and the physical or chemical variable to be measured as well as hermetic insulation and mechanical protection of the silicon sensor and its electrically active components. Unlike application specific packaging...

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Bibliographische Detailangaben
Hauptverfasser: Krassow, H., Heimlich, D., Campabadal, F., Lora-Tamayo, E.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Chemical elements
Chemical sensors
Dielectrics and electrical insulation
Electric variables measurement
Mechanical sensors
Mechanical variables measurement
Microelectronics
Packaging
Protection
Silicon
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Beschreibung
Zusammenfassung:The packaging technique presented provides direct interaction between the sensing element and the physical or chemical variable to be measured as well as hermetic insulation and mechanical protection of the silicon sensor and its electrically active components. Unlike application specific packaging methods, it therefore can potentially be applied to a variety of microelectronic sensors.
DOI:10.1109/SENSOR.1997.613637