High performance Si.45Ge.55 Implant Free Quantum Well FET featuring low temperature process, eSiGe stressor and transversal strain relaxation

High performance Si.45Ge.55 Implant Free Quantum Well FET featuring low temperature process, eSiGe stressor and transversal strain relaxation

In this work, we report high performance Si .45 Ge .55 Implant Free Quantum Well (IFQW) pFET with high drive current of 1.28mA/um at Ioff=160nA/um at channel length/width of 30nm/0.16um (Vdd=-1V). This is enabled by 1) low temperature process which maintains the integrity of the high mobility of Si...

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Hauptverfasser: Yamaguchi, S., Witters, L., Mitard, J., Eneman, G., Hellings, G., Fukuda, M., Hikavyy, A., Loo, R., Veloso, A., Crabbe, Y., Rohr, E., Favia, P., Bender, H., Takeoka, S., Vellianitis, G., Wang, W., Ragnarsson, L. A., De Meyer, K., Steegen, A., Horiguchi, N.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Implants
Performance evaluation
Silicon
Silicon germanium
Strain
Stress
Very large scale integration
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Zusammenfassung:In this work, we report high performance Si .45 Ge .55 Implant Free Quantum Well (IFQW) pFET with high drive current of 1.28mA/um at Ioff=160nA/um at channel length/width of 30nm/0.16um (Vdd=-1V). This is enabled by 1) low temperature process which maintains the integrity of the high mobility of Si .45 Ge .55 channel, 2) embedded SiGe (eSiGe) stressor which is fully compatible with SiGe channel and 3) relaxation of unwanted transversal stress at narrow width channel which results in a significant mobility boost (1.9× mobility improvement from active width of 10um to 0.1um).
ISSN:0163-1918
2156-017X
DOI:10.1109/IEDM.2011.6131677