Full wafer level stacking without TSV applications to memory-only and heterogeneous SiP

Full wafer level stacking without TSV applications to memory-only and heterogeneous SiP

A technological break based on Wafer Level Package started in 2002; consists in only stacking Known Good Rebuilt Wafer (what Freescale named: RCP and Infineon named e-Wlb) instead of standard wafers. This approach allows to have a very good yield, on the contrary of the W2W with TSV technologies. Se...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Val, C., Noiray, P. C. J., Boulay, N.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
IEEE catalog
Mechanical sensors
Pacemakers
Stacking
Three dimensional displays
Through-silicon vias
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Beschreibung
Zusammenfassung:A technological break based on Wafer Level Package started in 2002; consists in only stacking Known Good Rebuilt Wafer (what Freescale named: RCP and Infineon named e-Wlb) instead of standard wafers. This approach allows to have a very good yield, on the contrary of the W2W with TSV technologies. Several applications will be presented on the medical area, industrial area and smart card area.
ISSN:2150-5934
2150-5942
DOI:10.1109/IMPACT.2011.6117181