Optimization of breaking processes in LTCC manufacturing

Optimization of breaking processes in LTCC manufacturing

The effect of mechanical relief and dividing parameters of LTCC are investigated. Two mechanical relief techniques - diamond wheel scratching and laser scribing - are discussed in the paper. The parameters of breaking were also examined. Based on these results, the parameters could be optimized, imp...

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Bibliographische Detailangaben
Hauptverfasser: Horvath, E., Erenyi, A., Geczy, A., Harsanyi, G.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Ceramics
diamond wheel scratching
Force
laser scribing
Lasers
LTCC
mechanical relief
Stress
Substrates
Wheels
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Zusammenfassung:The effect of mechanical relief and dividing parameters of LTCC are investigated. Two mechanical relief techniques - diamond wheel scratching and laser scribing - are discussed in the paper. The parameters of breaking were also examined. Based on these results, the parameters could be optimized, improving the technology of low temperature co-fired ceramic (LTCC) circuit production. With these settings, less production losses could be expected in the field of LTCC technology.
DOI:10.1109/SIITME.2011.6102708