Considering copper anisotropy for advanced TSV-modeling

This paper demonstrates that in case of e-plated copper in TSVs isotropic material behavior is not in every case an acceptable simplification for calculations. The investigation presents a method to extract effective elastic moduli of copper grain structures in TSVs using Electron Backscatter Diffraction-measurement (EBSD) and FE-simulation. The effective elastic moduli represent the averaged anisotropic behavior of the grain structure. A simplified model without grain structures using the calculated effective moduli instead can be implemented for further simulations. Results of the presented procedure are compared to results of common material assumptions.