3D specific systems design and CAD

3D stacking and integration can provide significant system advantages. Following a brief technology review, this abstract explores application drivers, design and CAD for 3D ICs. The main 3D exploitation explored in detail is that of logic on memory. This application is explored in a specific DSP ex...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Franzon, P. D., Davis, W. R., Thorolfsson, T., Melamed, S.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	3D IC 3DIC Bandwidth FFT Memory management memory on logic Silicon stacked memory Stacking Thermal analysis Three dimensional displays three dimensional IC Through-silicon vias TSV
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