3D specific systems design and CAD

3D specific systems design and CAD

3D stacking and integration can provide significant system advantages. Following a brief technology review, this abstract explores application drivers, design and CAD for 3D ICs. The main 3D exploitation explored in detail is that of logic on memory. This application is explored in a specific DSP ex...

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Bibliographische Detailangaben
Hauptverfasser: Franzon, P. D., Davis, W. R., Thorolfsson, T., Melamed, S.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
3D IC
3DIC
Bandwidth
FFT
Memory management
memory on logic
Silicon
stacked memory
Stacking
Thermal analysis
Three dimensional displays
three dimensional IC
Through-silicon vias
TSV
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Beschreibung
Zusammenfassung:3D stacking and integration can provide significant system advantages. Following a brief technology review, this abstract explores application drivers, design and CAD for 3D ICs. The main 3D exploitation explored in detail is that of logic on memory. This application is explored in a specific DSP example, showing a 25% power advantage when implemented in 3D compared with 2D. Finally critical areas that need better solutions are explored. These include cost management, design planning, test management, and thermal management.
DOI:10.1109/SAMOS.2011.6045479