Power noise suppression using Embedded Capacitance Material and Electromagnetic BandGap

Power noise suppression using Embedded Capacitance Material and Electromagnetic BandGap

Power noise suppression on a mixed signal board is investigated in this paper with focus on Embedded Capacitance Material (ECM) and mushroom-type Electromagnetic Bandgap (EBG). ECM and mushroom-type EBG's working mechanisms and their advantages and disadvantages on high speed power noise suppre...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Yu Xuequan, Chen Qilin, Cao Haiping
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Capacitors
Electronic countermeasures
Inductance
Metamaterials
Noise
Periodic structures
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Power noise suppression on a mixed signal board is investigated in this paper with focus on Embedded Capacitance Material (ECM) and mushroom-type Electromagnetic Bandgap (EBG). ECM and mushroom-type EBG's working mechanisms and their advantages and disadvantages on high speed power noise suppression are compared though simulation and confirmed on an experimental board. The combined performance of the two techniques is also studied.
ISSN:2158-110X
2158-1118
DOI:10.1109/ISEMC.2011.6038334