A new approach to the study of single bit failure mechanism in semiconductor devices

A new approach to the study of single bit failure mechanism in semiconductor devices

An investigation of open-contact failures in semiconductor devices is common issue. As we changed the cleaning condition of the contact, open failure happened. This contact has nitride in it and recess profile under it. To solve ambiguous fail mechanism we used various analysis methods. Especially,...

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Bibliographische Detailangaben
Hauptverfasser: Soon Ju Lee, Ju Hee Lee, Won Kim, Jong Hyeop Kim, Hyung Do Kim, Hee Chang Jang, Hyoung Ryeun Kim, Ho Joung Kim
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Chemicals
Cleaning
Epitaxial growth
Filling
Nitrogen
Plugs
Silicon
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Beschreibung
Zusammenfassung:An investigation of open-contact failures in semiconductor devices is common issue. As we changed the cleaning condition of the contact, open failure happened. This contact has nitride in it and recess profile under it. To solve ambiguous fail mechanism we used various analysis methods. Especially, double XTEM sample image was the key and we confirmed the mechanism by reproducing experiment.
ISSN:1946-1542
1946-1550
DOI:10.1109/IPFA.2011.5992784